L@W is pleased to announce that due to the overwhelming response to our recently launched free trial, we have extended the L@W Bonds trial period until the end of September 2010. The free trial, which began in July, allowed users the opportunity to experience L@W Bonds and the simplicity of its seamless integration with other essential L@W solutions.
It was launched in beta version and during these past few weeks with pilot users' valuable feedback, we have constantly upgraded the application with a latest release due out tomorrow.
In extending this trial period, our aim is to ensure users are able to experience the full functionality of L@W Bonds over a complete bond registration process. We are confident that it will quickly become the bond solution of choice.